M. Hornung, R. Frey, O. Brand, H. Baltes, C. Hafner
{"title":"Ultrasound barrier based on packaged micromachined membrane resonators","authors":"M. Hornung, R. Frey, O. Brand, H. Baltes, C. Hafner","doi":"10.1109/MEMSYS.1995.472599","DOIUrl":null,"url":null,"abstract":"We report on a prototype of a miniaturized, short range ultrasound barrier for contactless object detection. Micromachined membrane resonators with electrothermal excitation and piezoresistive detection of vibrations act as transducer elements. The devices are fabricated with an industrial silicon process on (100) wafers compatible to bipolar IC technology. The 1 mm by 1 mm membrane resonators have been optimized with respect to their sound generation efficiency. Moreover, we investigate packaging techniques in order to protect the transducer elements without obstructing the ultrasound path.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1995.472599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
We report on a prototype of a miniaturized, short range ultrasound barrier for contactless object detection. Micromachined membrane resonators with electrothermal excitation and piezoresistive detection of vibrations act as transducer elements. The devices are fabricated with an industrial silicon process on (100) wafers compatible to bipolar IC technology. The 1 mm by 1 mm membrane resonators have been optimized with respect to their sound generation efficiency. Moreover, we investigate packaging techniques in order to protect the transducer elements without obstructing the ultrasound path.