Partitioning of opto-electronic multichip modules

J. Fan, B. Catanzaro, C.K. Cheng, S.H. Lee
{"title":"Partitioning of opto-electronic multichip modules","authors":"J. Fan, B. Catanzaro, C.K. Cheng, S.H. Lee","doi":"10.1109/MCMC.1994.292513","DOIUrl":null,"url":null,"abstract":"This paper is the first attempt at using CAD for partitioning opto-electronic systems into opto-electronic multichip modules (OE MCM). We define a formulation for OE MCM partitioning and describe a new algorithm for optimizing this partitioning based on the minimization of the power consumption. We have implemented the algorithm by applying it to a multistage interconnect network and analyzing the improvement of the design.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292513","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This paper is the first attempt at using CAD for partitioning opto-electronic systems into opto-electronic multichip modules (OE MCM). We define a formulation for OE MCM partitioning and describe a new algorithm for optimizing this partitioning based on the minimization of the power consumption. We have implemented the algorithm by applying it to a multistage interconnect network and analyzing the improvement of the design.<>
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光电多芯片模块的划分
本文首次尝试使用CAD将光电系统划分为光电多芯片模块(OE MCM)。我们定义了OE MCM划分的公式,并描述了一种基于功耗最小化的优化划分的新算法。将该算法应用于一个多级互连网络中,并对设计的改进进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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