{"title":"Packaging structures utilizing new `pinless' grid array technologies and vacuum well processes to provide enhanced reliability and circuit densities","authors":"Patrick O. Nunally","doi":"10.1109/CICC.1989.56751","DOIUrl":null,"url":null,"abstract":"An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed","PeriodicalId":165054,"journal":{"name":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1989.56751","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed
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