Identification of MOS oxide defect location with a spatial resolution less than 0.1 /spl mu/m using photoemission microscope

T. Ohzone, M. Yuzaki, T. Matsuda, E. Kameda
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Abstract

The maximum photoemission position corresponding to an oxide defect was determined with a spatial resolution of less than 0.1 /spl mu/m by a combination of an improved photoemission microscope with a magnification of 500/spl times/ and a MOS capacitor test structure which had a periodic X-Y matrix pattern to define the precise oxide-defect location. The field-oxide islands, which had photoemission spots from the oxide defects, were distributed at random. The LOCOS edge corresponding to the intensity dent of the reflected light image was located at about +0.3 /spl mu/m from the gate-oxide edge. The oxide defects were located in a range from +0.4/spl sim/-0.1 /spl mu/m from the LOCOS edge.
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利用光电显微镜以小于0.1 /spl mu/m的空间分辨率识别MOS氧化物缺陷位置
利用放大倍数为500/spl倍的光电显微镜和具有周期性X-Y矩阵图的MOS电容测试结构,确定了氧化缺陷对应的最大光电发射位置,其空间分辨率小于0.1 /spl mu/m。由氧化缺陷产生的具有发光点的场-氧化岛是随机分布的。反射光图像强度凹痕对应的LOCOS边缘位于栅极氧化物边缘+0.3 /spl mu/m左右。氧化物缺陷位于LOCOS边缘的+0.4/spl sim/-0.1 /spl mu/m范围内。
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