Pre-Amorphization Implants and in-situ Surface Preparation Optimization for Low Co-Silicided Area Density

Abstract

Until the 90-nm node, CoSi 2 silicide have been widely used in semiconductor industry. More recently, in order to meet performance requirements in advanced digital nodes, process integration have consensually shifted towards NiPt-based silicides [1] . Nevertheless, advanced memory and imaging technologies being still based on 90-nm core MOS, developments and studies on CoSi 2 silicide are still of the best interest as new challenges are emerging.