A 219–266 GHz fully-integrated direct-conversion IQ receiver module in a SiGe HBT technology

P. R. Vazquez, J. Grzyb, N. Sarmah, B. Heinemann, U. Pfeiffer
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引用次数: 16

Abstract

This paper presents a fully-integrated direct-conversion fundamentally-operated mixer-first quadrature receiver chip working at 240 GHz. It has been implemented in a 0.13-μm SiGe HBT technology with fT/fmax of 350/550 GHz. The chip includes an LO path based on a x16 multiplier with a 3-stage PA, driven externally from the PCB at 14–18 GHz. The LO signal is split in quadrature by a broadband coupler. It drives two double-balanced fundamentally-operated mixers with their RF ports connected directly to a wideband lens-integrated linearly-polarized on-chip ring antenna. For low-cost packaging, the chip-on-lens assembly is wire-bonded onto a high-speed PCB, where an on-board 8-section step-impedance microstrip-line low-pass filter has been implemented to compensate the wire-bond inductance at the IF outputs. The 3-dB RF/LO operation BW (with fixed IF) is 47 GHz with peak CG of 7.8 dB, and minimum SSB NF of 11.3 dB, whereas a 3-dB IF bandwidth is at least 12 GHz. All measurement results have been taken at the board-level and include the implementation losses of both the antenna and the on-board high-speed interconnects. The receiver IQ amplitude imbalance is below 1.58 dB for the 210–280 GHz band. In combination with a 9-mm silicon lens, the receiver module provides a directivity of 25.2 to 27.04 dBi from 210 to 280 GHz.
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采用SiGe HBT技术的219-266 GHz全集成直接转换IQ接收器模块
本文提出了一种工作频率为240 GHz的全集成直接转换基控混合器优先正交接收芯片。它采用0.13 μm SiGe HBT技术实现,fT/fmax为350/550 GHz。该芯片包括一个基于x16乘法器的LO路径,带有3级PA,从PCB外部驱动,频率为14-18 GHz。本LO信号通过宽带耦合器进行正交分割。它驱动两个双平衡基本操作混频器,其RF端口直接连接到宽带透镜集成线性极化片上环形天线。为了实现低成本封装,镜头上的芯片组件通过线键连接到高速PCB上,其中板上的8段阶跃阻抗微带线低通滤波器已经实现,以补偿中频输出处的线键电感。3db RF/LO工作BW(固定中频)为47ghz,峰值CG为7.8 dB,最小SSB NF为11.3 dB,而3db中频带宽至少为12ghz。所有测量结果都是在板级进行的,包括天线和板上高速互连的实现损耗。在210 ~ 280 GHz频段,接收机IQ幅值不平衡小于1.58 dB。结合9毫米硅透镜,接收模块在210至280 GHz范围内提供25.2至27.04 dBi的指向性。
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