Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting

Abstract

The miniaturization in electronics is driven by size reduction and cost, however by increasing the technical performance of the device. In regard to wafer level applications flip chip technology is still one of the interconnection methods with the potential of highest integration and cost savings. For applications other than on wafer level, 3-dimensional packages like e.g. camera modules, read-write heads for hard disk drives and various other applications a solder jetting method using solder ball diameters down to 30μm is used.