Which junction for advanced CMOS?-theory, benchmark and predictions

T. Skotnicki
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引用次数: 2

Abstract

In this paper, the theoretical considerations about junction design for advanced CMOS, to benchmark the most recent and advanced results, and make some predictions on the future needs are presented. Junction scaling is the key difference that grants better electrostatic integrity (essentially smaller DIBL) to SON/SOI and DG structures if compared with bulk. With the use of these structures, DIBL can be kept under control (<100 mV) down to 5-10 nm gate length.
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先进的CMOS采用哪个结?-理论、基准和预测
本文提出了先进CMOS结设计的理论考虑,对最新和先进的结果进行了基准测试,并对未来的需求进行了一些预测。结垢是与体相比,SON/SOI和DG结构具有更好的静电完整性(本质上是更小的DIBL)的关键区别。使用这些结构,DIBL可以保持在控制(<100 mV)到5-10 nm栅极长度。
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