{"title":"Formation of micro eaves analyzed by energy balance model at threefold of Cu film/DFR/Ni plating solution","authors":"H. Yoshida, T. Nakamura, Y. Kawakami, A. Kawai","doi":"10.1109/IMNC.2000.872636","DOIUrl":null,"url":null,"abstract":"DFR (Dry Film Photoresist) is widely used mainly in micro plating process. However as the result of liquid intrusion into substrate/DFR interface, a bird's-beak like \"eaves\" is formed at bottom of a plating pattern. The purpose of this presentation is to clarify the mechanism of the \"eaves\" formation by analyzing adhesion energies at the substrate/DFR/liquids threefold.","PeriodicalId":270640,"journal":{"name":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","volume":"794 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMNC.2000.872636","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
DFR (Dry Film Photoresist) is widely used mainly in micro plating process. However as the result of liquid intrusion into substrate/DFR interface, a bird's-beak like "eaves" is formed at bottom of a plating pattern. The purpose of this presentation is to clarify the mechanism of the "eaves" formation by analyzing adhesion energies at the substrate/DFR/liquids threefold.
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