Role of adhesion and its reliability implications in electronic assemblies

Abstract

An important aspect in the fabrication of electronic packages and assemblies is the joining of similar as well dissimilar pairs of materials with a range of physicochemical characteristics. Metal-metal, metal-polymer, and polymer-polymer interface are encountered. It is important to ensure adequate interfacial bonding, namely, adhesion strength between the material pairs for product performance in the intended operating environment. In this paper are highlighted some of the adhesion aspects that are relevant to first and second level electronic packaging and their impact on reliability.