A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring

Y. Araga, Ranto Miura, M. Nagata, C. Neve, J. de Vos, G. van der Plas, E. Beyne
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引用次数: 1

Abstract

A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate noise propagation in the stacked system.
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基于动态电源电流仿真和功率噪声监测的三维芯片堆栈电源完整性研究
研制了一种模拟异质集成系统中噪声产生和传播的三维集成测试车。叠内波形捕捉器嵌入每一层捕捉噪声的产生和传播。建立了一个一致的分析模型,并使用该模型进行分析,使我们能够制定一种设计策略,用于电力输送网络,以衰减堆叠系统中的噪声传播。
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