Alina Deutsch, Howard H. Smith, G. Katopis, Wiren D. Becker, P. Coteus, C. Surovic, G. Kopcsay, Barry J. Rubin, R. P. Dunne, T. Gallo, D. R. Knebel, B. L. Krauter, L. M. Terman, G. Sai-Halasz, P. J. Reslte
{"title":"The importance of inductance and inductive coupling for on-chip wiring","authors":"Alina Deutsch, Howard H. Smith, G. Katopis, Wiren D. Becker, P. Coteus, C. Surovic, G. Kopcsay, Barry J. Rubin, R. P. Dunne, T. Gallo, D. R. Knebel, B. L. Krauter, L. M. Terman, G. Sai-Halasz, P. J. Reslte","doi":"10.1109/EPEP.1997.634037","DOIUrl":null,"url":null,"abstract":"The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top three layers in a five-layer wiring structure and guidelines are formulated. In-plane and between-plane crosstalk and delay dependence on driver and receiver circuit device sizes and line lengths and width are analyzed with representative CMOS circuits. Simplified constant-parameter, distributed coupled-line RLC-circuit representation that approximates the waveforms predicted with frequency-dependent line parameters is shown to be feasible.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"82 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"41","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634037","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 41
Abstract
The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top three layers in a five-layer wiring structure and guidelines are formulated. In-plane and between-plane crosstalk and delay dependence on driver and receiver circuit device sizes and line lengths and width are analyzed with representative CMOS circuits. Simplified constant-parameter, distributed coupled-line RLC-circuit representation that approximates the waveforms predicted with frequency-dependent line parameters is shown to be feasible.