Impact of process characteristics on submicron defect effects

B.W. Smith, K. Hirschman
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Abstract

The impact of submicron mask defect printability for semiconductor processing is investigated. Computer simulations of image intensities resulting from programmed defects are compared to recorded images produced from defects of known size and proximity. Defects ranging in sizes from 0.6 to 2.0 mu m, located from 0 to 5 mu m from features imaged in various resist materials over silicon, silicon dioxide, silicon nitride, polysilicon, and aluminum show varying degrees of printability. Results analyzed through scanning electron microscopy are compared to theoretical results through two-dimensional modeling.<>
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工艺特性对亚微米缺陷效应的影响
研究了亚微米掩模缺陷对半导体加工可印刷性的影响。由程序缺陷产生的图像强度的计算机模拟与由已知尺寸和接近程度的缺陷产生的记录图像进行比较。在硅、二氧化硅、氮化硅、多晶硅和铝等各种抗蚀剂材料中,尺寸从0.6到2.0 μ m的缺陷位于距离特征0到5 μ m处,显示出不同程度的可印刷性。扫描电镜分析的结果与二维模型的理论结果进行了比较。
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