F. Herzel, M. Kucharski, A. Ergintav, J. Borngräber, H. Ng, J. Domke, D. Kissinger
{"title":"An integrated frequency synthesizer in 130 nm SiGe BiCMOS technology for 28/38 GHz 5G wireless networks","authors":"F. Herzel, M. Kucharski, A. Ergintav, J. Borngräber, H. Ng, J. Domke, D. Kissinger","doi":"10.23919/EUMIC.2017.8230703","DOIUrl":null,"url":null,"abstract":"An integrated frequency synthesizer for 28.733.7 GHz is presented. This wide tuning range is achieved at low phase noise by combining capacitive tuning and inductor switching in the voltage-controlled oscillator (VCO). The synthesizer lends itself to the realization of integrated transceiver frontends when using a sliding-IF architecture, both for the 28 GHz and the 38 GHz band. It occupies a chip area of 5 mm2 including bondpads and draws 171 mA from a 2.5 V supply. The phase noise at 1 MHz offset from the 30 GHz carrier is between −100 and −97 dBc/Hz.","PeriodicalId":120932,"journal":{"name":"2017 12th European Microwave Integrated Circuits Conference (EuMIC)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 12th European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EUMIC.2017.8230703","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
An integrated frequency synthesizer for 28.733.7 GHz is presented. This wide tuning range is achieved at low phase noise by combining capacitive tuning and inductor switching in the voltage-controlled oscillator (VCO). The synthesizer lends itself to the realization of integrated transceiver frontends when using a sliding-IF architecture, both for the 28 GHz and the 38 GHz band. It occupies a chip area of 5 mm2 including bondpads and draws 171 mA from a 2.5 V supply. The phase noise at 1 MHz offset from the 30 GHz carrier is between −100 and −97 dBc/Hz.