A. Chowdhury, B. Guenin, R. Groover, S. Anderson, E.J. Derian
{"title":"Thermally-enhanced SOIC packages for power IC devices","authors":"A. Chowdhury, B. Guenin, R. Groover, S. Anderson, E.J. Derian","doi":"10.1109/ISPSD.1996.509505","DOIUrl":null,"url":null,"abstract":"Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509505","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Different design techniques to improve the thermal performance of a standard SOIC package have been evaluated and their thermal performance compared through thermal models by utilizing finite element analysis. It is shown that by enhancing the design of a standard SOIC package the thermal performance can be improved by as much as 46% over that of the standard design.
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