Hydrogen effect on ultra-shallow arsenic n/sup +//p junction formed by AsH/sub 3/ plasma doping (PLAD)

S. Heo, S. Baek, Dongkyu Lee, Gyongho Buh, Yu-jeung Sin, H. Hwang
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Abstract

The electrical and structural characteristics of junction was affected during the activation annealing which was interpreted as a hydrogen effect. In this work, the hydrogen effect of arsenic n/sup +//p ultra-shallow junction formed by AsH/sub 3/ (arsine) plasma doping is reported. The additional hydrogen dopant retards the dopant activation due to the hydrogen damage effect confirmed by HR-XTEM analysis. The low temperature pre-annealing efficiently reduced residual defect. To obtain the high quality arsenic n/sup +//p junction formed by plasma doping, an additional annealing method is needed to remove the hydrogen damage effect. To measure electrical characteristics such as the sheet resistance and activated carrier concentration of doped samples, hall measurement was done.
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AsH/sub - 3/等离子体掺杂(PLAD)形成的超浅砷n/sup +//p结的氢效应
在活化退火过程中,结的电学和结构特性受到影响,这被解释为氢效应。本文报道了AsH/sub - 3/ (arsine)等离子体掺杂形成的砷n/sup +//p超浅结的氢效应。氢- xtem分析证实了氢损伤效应对掺杂剂活化的影响。低温预退火有效地减少了残余缺陷。为了获得等离子体掺杂形成的高质量的砷n/sup +//p结,需要采用额外的退火方法来消除氢损伤效应。为了测量掺杂样品的片电阻和活化载流子浓度等电学特性,进行了霍尔测量。
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