A. Hagimura, K. Shima, K. Asahina, H. Sakuraba, K. Fujita, J. Tanaka
{"title":"Application for ball grid array package by using high heat resistant substrate (BN300)","authors":"A. Hagimura, K. Shima, K. Asahina, H. Sakuraba, K. Fujita, J. Tanaka","doi":"10.1109/IEMT.1996.559684","DOIUrl":null,"url":null,"abstract":"High heat resistance substrate material, BN300, which MTC has developed utilizing MTC's polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559684","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
High heat resistance substrate material, BN300, which MTC has developed utilizing MTC's polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed.
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