Interconnection Reliability of Mini LEDs for Display Applications

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00190

In-seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-seok Jang, Y. Eom, Kwang-Seong Choi, Yong-Jun Oh

{"title":"Interconnection Reliability of Mini LEDs for Display Applications","authors":"In-seok Kye, Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Ki-seok Jang, Y. Eom, Kwang-Seong Choi, Yong-Jun Oh","doi":"10.1109/ectc51906.2022.00190","DOIUrl":null,"url":null,"abstract":"Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00190","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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Abstract

Micro/Mini-LED displays have many advantages compared to other displays. However, the reliability data required for the commercialization of mini-LEDs is insufficient. In this study, we analyzed the reliability of mini-LEDs by comparing the shear strength and microstructure of their solder joints before and after conducting a reliability test. We first performed a simultaneous transfer and bonding (SITRAB) process to mount mini-LEDs on a substrate. To analyze the effect of underfill on mini-LED reliability, we compared those both with and without SITRAB adhesive. The mini-LED with SITRAB adhesive showed a small decrease in shear strength after the reliability test, whereas the mini-LED without SITRAB adhesive showed a large decrease in shear strength after the reliability test. As a result of measuring the optical characteristics of the LED after the reliability test, it was observed that there was no change in the characteristics of the mini-LED. It can be concluded that the SITRAB process with SITRAB adhesive improved the reliability of mini-LEDs.

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用于显示应用的迷你led互连可靠性

与其他显示器相比，Micro/Mini-LED显示器具有许多优点。然而，迷你led商业化所需的可靠性数据还不够。在本研究中，我们通过比较mini- led焊点在进行可靠性测试前后的剪切强度和微观结构来分析其可靠性。我们首先进行了同步转移和键合(SITRAB)工艺，将迷你led安装在衬底上。为了分析下填料对mini-LED可靠性的影响，我们比较了使用和不使用SITRAB粘合剂的mini-LED可靠性。使用SITRAB粘合剂的mini-LED在可靠性试验后抗剪强度下降幅度较小，而未使用SITRAB粘合剂的mini-LED在可靠性试验后抗剪强度下降幅度较大。由于在可靠性测试后测量了LED的光学特性，观察到mini-LED的特性没有变化。综上所述，使用SITRAB粘合剂的SITRAB工艺提高了mini- led的可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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