10 A/950 V switching of GaN-channel HFETs with non-doped AlN buffer

O. Hilt, F. Brunner, M. Wolf, Eldad Bahat Treidel, J. Würfl, A. Thies, A. Mogilatenko
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Abstract

AlN-based semiconductor devices are considered to outperform lateral AlGaN/GaN HFETs for power-electronic switching applications due to the high AlN-material breakdown field strength. We present an AlGaN/GaN /AlN-HFET transistor without any compensation doping in the AlN-buffer layer. Breakdown voltage scaling as function of the gate-drain separation of 140 V/µm and power figure-of-merit of 2.4 GW/cm2 were achieved which is superior to most other GaN device technologies. 120 m Ω power transistors demonstrated 10 A switching transients up to 950 V off-state voltage and thus meet basic requirements for kW-range power switching. The origin of still present dispersion effects during high voltage switching could be attributed to a high structural defect density at the AlN-buffer / GaN channel material interface.
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非掺杂AlN缓冲gan沟道hfet的10a / 950v开关
由于高aln材料击穿场强,基于aln的半导体器件被认为在电力电子开关应用中优于横向AlGaN/GaN hfet。我们提出了一种在aln缓冲层中没有任何补偿掺杂的AlGaN/GaN /AlN-HFET晶体管。击穿电压随栅漏分离的变化可达到140 V/µm,功率优值为2.4 GW/cm2,优于大多数其他GaN器件技术。120m Ω功率晶体管的开关瞬态电压可达10a,断态电压可达950 V,满足kw范围功率开关的基本要求。在高压开关过程中仍然存在的色散效应的起源可归因于aln缓冲液/ GaN通道材料界面处的高结构缺陷密度。
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