{"title":"Radiation characteristics of small loop antenna above perforated finite image plane","authors":"R. Blečić, R. Gillon, B. Nauwelaers, A. Barić","doi":"10.1109/EMCCOMPO.2015.7358361","DOIUrl":null,"url":null,"abstract":"Radiation characteristics of a loop antenna, small compared to the wavelength and placed centrally above a perforated finite image plane, are presented. Holes in the image plane typically occur in a multilayer printed circuit boards (PCBs) when vias pass through the second layer which serves as a reflector. A 3D finite element method (FEM) electromagnetic (EM) simulation of a System-in-Package (SiP) synchronous buck converter shows a significant impact of the holes on the characteristics of the converter. A parametric analysis of the impact of the number and radius of holes on the radiated characteristics and on the inductance of a small loop antenna above perforated image plane is performed by 3D FEM EM simulations. Guidelines for a design of multilayer PCBs for magnetically driven sources, such as DC-DC converters, are deduced.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2015.7358361","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Radiation characteristics of a loop antenna, small compared to the wavelength and placed centrally above a perforated finite image plane, are presented. Holes in the image plane typically occur in a multilayer printed circuit boards (PCBs) when vias pass through the second layer which serves as a reflector. A 3D finite element method (FEM) electromagnetic (EM) simulation of a System-in-Package (SiP) synchronous buck converter shows a significant impact of the holes on the characteristics of the converter. A parametric analysis of the impact of the number and radius of holes on the radiated characteristics and on the inductance of a small loop antenna above perforated image plane is performed by 3D FEM EM simulations. Guidelines for a design of multilayer PCBs for magnetically driven sources, such as DC-DC converters, are deduced.
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