{"title":"Chip-to-chip half duplex data communication at 135 Mbps over power-supply rails","authors":"T. Hashida, Y. Bando, M. Nagata","doi":"10.1109/ASSCC.2008.4708765","DOIUrl":null,"url":null,"abstract":"Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at 135 Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by more than 30 dB, purifying power supply current for internal circuits. Chip-to-chip power line communication invokes supplementary diagnosis functionality to be embedded in SoCs at the time of power connection, with the reduced cost of pin counts.","PeriodicalId":143173,"journal":{"name":"2008 IEEE Asian Solid-State Circuits Conference","volume":"288 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE Asian Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2008.4708765","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at 135 Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by more than 30 dB, purifying power supply current for internal circuits. Chip-to-chip power line communication invokes supplementary diagnosis functionality to be embedded in SoCs at the time of power connection, with the reduced cost of pin counts.