Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi, T. Saraya, M. Kobayashi, E. Higurashi, H. Toshiyoshi, T. Hiramoto
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引用次数: 4
Abstract
A three-layered daisy-chain test device in which each layer is electrically interconnected with 6-μm-pitch Au electrodes is fabricated using a direct-bonding technique. The experimental results show a series of electrical interconnections exceeding 986,000 contacts, with the Au contact resistance for a single connection being approximately 92.8 mΩ.
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