Strained silicon FETs on thin SiGe virtual substrates produced by He implantation: reduced self-heating on DC and RF performance

T. Hackbarth, H. Herzog, K. Hieber, U. Konig, S. Mantl, B. Hollander, S. Lenk, H. von Kanel
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引用次数: 1

Abstract

In this work, MODFET layer stacks with a Ge fraction x=33% were grown by molecular beam epitaxy on thin virtual substrate (VS). A method has been developed to produce thin SRB (strain relieved buffer) SiGe layers (100-200 nm) using He implantation and subsequent annealing (750-900 /spl deg/C) to relax the strain of a pseudomorphic SiGe layer. The degree of relaxation was measured by high resolution X-ray diffraction. To assess the impact of self-heating, the output characteristics were recorded with an ACCENT Diva D225 system in the static and in the pulsed mode with 200 ns pulses at a duty cycle of 1:1000. The difference in the I/V curve between the static and the pulsed mode is much larger for the thick VS indicating enhanced self-heating. Finally, RF measurements up to 50 GHz were carried out on the two VS versions.
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He注入制备的薄型SiGe虚拟衬底上应变硅场效应管:减少直流和射频性能的自热
本文采用分子束外延的方法在薄虚拟衬底(VS)上生长出了Ge分数为x=33%的MODFET层。本文提出了一种利用He注入和750-900 /spl度/C退火的方法来制备薄的SRB(应变缓解缓冲)SiGe层(100-200 nm)。用高分辨率x射线衍射测量了弛豫度。为了评估自加热的影响,用ACCENT Diva D225系统记录了静态和脉冲模式下的输出特性,其中200 ns脉冲占空比为1:1000。对于厚VS,静态模式和脉冲模式之间的I/V曲线差异要大得多,表明自热增强。最后,在两个VS版本上进行了高达50 GHz的射频测量。
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