Qualified manufacturer's list (QML)-a new approach for qualifying ASICs

C. Messenger
{"title":"Qualified manufacturer's list (QML)-a new approach for qualifying ASICs","authors":"C. Messenger","doi":"10.1109/ASIC.1990.186073","DOIUrl":null,"url":null,"abstract":"The task of device qualification becomes more arduous when the process is applied to application-specific integrated circuits (ASICs) where quick turn-around and low volumes are involved. These problems have been addressed by developing a process oriented system where the disciplines of design, fabrication, assembly, and test for a given technology are certified and qualified instead to individual devices. This approach, defined in MIL-I-38535 General Specifications for Integrated Circuits Manufacturing, is an outgrowth of the RADC Generic Qualification Program. Manufacturers who successfully complete the requirements will be listed on a qualified manufacturer's listing (QML) and all products built and tested on the QML flow will be qualified for use in military systems. The QML requirements address all types of integrated circuits. Issues of certifying testability/fault coverage capabilities, cell libraries, design and electrical rules, and design flow procedures are detailed. The concept is being expanded to encompass linear design, space-critical, and radiation-hardened requirements and GaAs fabrication, design, and test procedures.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186073","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The task of device qualification becomes more arduous when the process is applied to application-specific integrated circuits (ASICs) where quick turn-around and low volumes are involved. These problems have been addressed by developing a process oriented system where the disciplines of design, fabrication, assembly, and test for a given technology are certified and qualified instead to individual devices. This approach, defined in MIL-I-38535 General Specifications for Integrated Circuits Manufacturing, is an outgrowth of the RADC Generic Qualification Program. Manufacturers who successfully complete the requirements will be listed on a qualified manufacturer's listing (QML) and all products built and tested on the QML flow will be qualified for use in military systems. The QML requirements address all types of integrated circuits. Issues of certifying testability/fault coverage capabilities, cell libraries, design and electrical rules, and design flow procedures are detailed. The concept is being expanded to encompass linear design, space-critical, and radiation-hardened requirements and GaAs fabrication, design, and test procedures.<>
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
合格制造商列表(QML)-一种合格asic的新方法
当该工艺应用于涉及快速周转和低产量的专用集成电路(asic)时,器件鉴定的任务变得更加艰巨。这些问题已经通过开发一个面向过程的系统来解决,在这个系统中,给定技术的设计、制造、组装和测试的规程被认证和合格,而不是单个设备。这种方法在MIL-I-38535集成电路制造通用规范中定义,是RADC通用资格认证计划的产物。成功完成要求的制造商将被列入合格制造商列表(QML),所有在QML流程上构建和测试的产品将有资格用于军事系统。QML要求适用于所有类型的集成电路。详细介绍了验证可测试性/故障覆盖能力、单元库、设计和电气规则以及设计流程的问题。该概念正在扩展到线性设计、空间关键、辐射硬化要求以及GaAs制造、设计和测试程序。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A development system for an SRAM-based user-reprogrammable gate array Automated CAE tools for full custom design of bipolar analog ASICs A 200 MHz 100 K ECL output buffer for CMOS ASICs Multi circular buffer controller chip for advanced ESM system Rapid prototyping, is there an educational dilemma? (ASIC design)
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1