Impact of Mechanical Bending on the Performance of Organic Thin-Film Transistors and the Characteristic Temperature of the Density of States

Aristeidis Nikolaou, Jakob Leise, Jakob Pruefer, U. Zschieschang, H. Klauk, G. Darbandy, B. Iñíguez, A. Kloes
{"title":"Impact of Mechanical Bending on the Performance of Organic Thin-Film Transistors and the Characteristic Temperature of the Density of States","authors":"Aristeidis Nikolaou, Jakob Leise, Jakob Pruefer, U. Zschieschang, H. Klauk, G. Darbandy, B. Iñíguez, A. Kloes","doi":"10.23919/mixdes55591.2022.9837960","DOIUrl":null,"url":null,"abstract":"In this study, the effect of bending on the electrical characteristics of organic thin-film transistors is studied, using experimental data obtained from a large number of discrete or-ganic transistors fabricated on a flexible polymeric substrates, in the coplanar device architecture. The transistors under bending-stress presented a significant drain-current degradation that can be mainly attributed to the respected reduction of the effective carrier mobility value. By correlating a power-law mobility model and the basics of percolation theory, the observed mobility degradation could be attributed to a decrease of the characteristic temperature that describes the shape of the Gaussian density of states in the utilized organic semiconductor. Overall, a maximum effective carrier mobility degradation of 45.9% due to bending, depending on the experimental conditions, can be reported.","PeriodicalId":356244,"journal":{"name":"2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/mixdes55591.2022.9837960","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In this study, the effect of bending on the electrical characteristics of organic thin-film transistors is studied, using experimental data obtained from a large number of discrete or-ganic transistors fabricated on a flexible polymeric substrates, in the coplanar device architecture. The transistors under bending-stress presented a significant drain-current degradation that can be mainly attributed to the respected reduction of the effective carrier mobility value. By correlating a power-law mobility model and the basics of percolation theory, the observed mobility degradation could be attributed to a decrease of the characteristic temperature that describes the shape of the Gaussian density of states in the utilized organic semiconductor. Overall, a maximum effective carrier mobility degradation of 45.9% due to bending, depending on the experimental conditions, can be reported.
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机械弯曲对有机薄膜晶体管性能的影响及态密度特征温度
在这项研究中,弯曲对有机薄膜晶体管电特性的影响进行了研究,使用的实验数据来自于在柔性聚合物衬底上制造的大量离散或有机晶体管,在共面器件结构中。弯曲应力下的晶体管表现出明显的漏极电流退化,这主要归因于有效载流子迁移率值的显著降低。通过将幂律迁移率模型与渗透理论的基础相关联,观察到的迁移率退化可归因于描述所利用有机半导体中高斯态密度形状的特征温度的降低。总的来说,根据实验条件的不同,由于弯曲导致的最大有效载流子迁移率下降为45.9%。
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