Printed circuit board material and design considerations for wireless applications

B. Daigle
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引用次数: 11

Abstract

Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized.
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无线应用的印刷电路板材料和设计考虑
设计师们正朝着可以使用传统环氧树脂/玻璃印刷电路板(PCB)工艺制造的材料系统发展。这使得微波电路可以使用数字电路的庞大制造基础设施来构建。本文提供了对无线应用至关重要的衬底材料特性和设计考虑的基本背景信息。讨论的材料特性包括耗散系数、介电常数公差和稳定性。设计和材料的选择,使微波电路是由传统的FR4制造商制造强调。
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