{"title":"A Case Study of Yield Improvement in a FEOL Wet Clean Process","authors":"R. Mitra, Zhiyong Xie","doi":"10.1109/ASMC.2019.8791786","DOIUrl":null,"url":null,"abstract":"Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791786","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.
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