{"title":"A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages","authors":"Chang Liu, A. Yılmaz","doi":"10.1109/EPEPS47316.2019.193213","DOIUrl":null,"url":null,"abstract":"A reduced-domain layered-medium integral-equation method that models the finite thickness, finite conductivity, and surface roughness of large metallizations via layered-medium Green’s functions is presented. Using a package-scale benchmark interconnect structure, the method is shown to lower the computational cost and complexity of network parameter extraction when an FFT-accelerated iterative solver is used (as it improves matrix conditioning and reduces number of unknowns) without compromising accuracy.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193213","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A reduced-domain layered-medium integral-equation method that models the finite thickness, finite conductivity, and surface roughness of large metallizations via layered-medium Green’s functions is presented. Using a package-scale benchmark interconnect structure, the method is shown to lower the computational cost and complexity of network parameter extraction when an FFT-accelerated iterative solver is used (as it improves matrix conditioning and reduces number of unknowns) without compromising accuracy.
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