Curling-PCM: Application-specific wear leveling for phase change memory based embedded systems

Duo Liu, Tianzheng Wang, Yi Wang, Z. Shao, Qingfeng Zhuge, E. Sha
{"title":"Curling-PCM: Application-specific wear leveling for phase change memory based embedded systems","authors":"Duo Liu, Tianzheng Wang, Yi Wang, Z. Shao, Qingfeng Zhuge, E. Sha","doi":"10.1109/ASPDAC.2013.6509609","DOIUrl":null,"url":null,"abstract":"Phase change memory (PCM) has been used as NOR flash replacement in embedded systems with its attractive features. However, the endurance of PCM keeps drifting down and greatly limits its adoption in embedded systems. As most embedded systems are application-oriented, we can better utilize PCM by exploring application-specific features such as fixed access patterns and update frequencies to prolong the lifetime of PCM. In this paper, we propose an application-specific wear leveling technique, called Curling-PCM, to evenly distribute write activities across the PCM chip in order to improve the endurance of PCM. The basic idea is to exploit application-specific features in embedded systems and periodically move the hot region across the whole PCM chip. To further reduce the overhead of moving the hot region and improve the performance of PCM-based embedded systems, a fine-grained partial wear leveling policy is proposed in Curling-PCM, by which only part of the hot region is moved during each request handling period. The experimental results show that Curling-PCM can effectively evenly distribute write traffic in PCM chips compared with previous work. We expect this work can serve as a first step towards the full exploration of application-specific features in PCM-based embedded systems.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"61","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2013.6509609","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 61

Abstract

Phase change memory (PCM) has been used as NOR flash replacement in embedded systems with its attractive features. However, the endurance of PCM keeps drifting down and greatly limits its adoption in embedded systems. As most embedded systems are application-oriented, we can better utilize PCM by exploring application-specific features such as fixed access patterns and update frequencies to prolong the lifetime of PCM. In this paper, we propose an application-specific wear leveling technique, called Curling-PCM, to evenly distribute write activities across the PCM chip in order to improve the endurance of PCM. The basic idea is to exploit application-specific features in embedded systems and periodically move the hot region across the whole PCM chip. To further reduce the overhead of moving the hot region and improve the performance of PCM-based embedded systems, a fine-grained partial wear leveling policy is proposed in Curling-PCM, by which only part of the hot region is moved during each request handling period. The experimental results show that Curling-PCM can effectively evenly distribute write traffic in PCM chips compared with previous work. We expect this work can serve as a first step towards the full exploration of application-specific features in PCM-based embedded systems.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Curling-PCM:基于相变存储器的嵌入式系统的专用磨损平衡
相变存储器(PCM)以其独特的特性在嵌入式系统中被用作NOR闪存的替代品。然而,PCM的耐久性不断下降,极大地限制了其在嵌入式系统中的应用。由于大多数嵌入式系统都是面向应用程序的,我们可以通过探索特定于应用程序的特性(如固定访问模式和更新频率)来更好地利用PCM,以延长PCM的生命周期。在本文中,我们提出了一种特定应用的磨损平衡技术,称为Curling-PCM,以均匀地分布在PCM芯片上的写活动,以提高PCM的耐用性。其基本思想是利用嵌入式系统中特定应用程序的特性,并周期性地在整个PCM芯片上移动热点区域。为了进一步降低移动热区域的开销,提高基于pcm的嵌入式系统的性能,在curling_pcm中提出了一种细粒度的局部磨损均衡策略,在每个请求处理周期中只移动部分热区域。实验结果表明,与以往的工作相比,Curling-PCM可以有效地均匀分配PCM芯片上的写流量。我们期望这项工作可以作为全面探索基于pcm的嵌入式系统中特定应用程序特性的第一步。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Compiler-assisted refresh minimization for volatile STT-RAM cache Processor and DRAM integration by TSV-based 3-D stacking for power-aware SOCs Performance bound and yield analysis for analog circuits under process variations MIXSyn: An efficient logic synthesis methodology for mixed XOR-AND/OR dominated circuits Unconditionally stable explicit method for the fast 3-D simulation of on-chip power distribution network with through silicon via
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1