Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die

J.M. Czarnowski, M. Reynolds, M.T. Hayes, C. Ellis, R.W. Johnson, M. Palmer
{"title":"Evaluation of area bonding conductive adhesives for flip chip attach of area bonded die","authors":"J.M. Czarnowski, M. Reynolds, M.T. Hayes, C. Ellis, R.W. Johnson, M. Palmer","doi":"10.1109/IEMT.1996.559791","DOIUrl":null,"url":null,"abstract":"The new technologies of flip chip, DCA, and CSP require conversion from perimeter bond pads to total area bonded dies. To fill this need, new low-cost area bonding conductive (ABC) adhesives have been developed under an ARPA TRP grant. An ABC adhesive is a two region thermoset adhesive with electrically conductive epoxy adhesive pads surrounded by a continuous oxide filled dielectric adhesive to form a total area bond. Both regions are solvent free, B-staged, non tacky epoxies supplied on a Mylar carrier release film, which cure, with no volatiles or outgassing to yield high Tg, high strength adhesive bonds. In contrast to previous random particle Z-axis adhesives, the ABC adhesives have conductive areas only at the bond pad locations. Area bond test die, designed and fabricated by the Auburn University Microelectronics Center have been successfully bonded to FR4, flex, and thin film ceramic substrates. Test die features include four point Kelvin contact strings and interdigitated daisy chains on 10 mil and 20 mil pitch. Various surface metallizations have been explored and evaluated. Cure times and temperatures are being optimized. This paper will discuss design and fabrication of the test die, including surface metallization and the problems encountered therein. It will describe the process and its optimization.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The new technologies of flip chip, DCA, and CSP require conversion from perimeter bond pads to total area bonded dies. To fill this need, new low-cost area bonding conductive (ABC) adhesives have been developed under an ARPA TRP grant. An ABC adhesive is a two region thermoset adhesive with electrically conductive epoxy adhesive pads surrounded by a continuous oxide filled dielectric adhesive to form a total area bond. Both regions are solvent free, B-staged, non tacky epoxies supplied on a Mylar carrier release film, which cure, with no volatiles or outgassing to yield high Tg, high strength adhesive bonds. In contrast to previous random particle Z-axis adhesives, the ABC adhesives have conductive areas only at the bond pad locations. Area bond test die, designed and fabricated by the Auburn University Microelectronics Center have been successfully bonded to FR4, flex, and thin film ceramic substrates. Test die features include four point Kelvin contact strings and interdigitated daisy chains on 10 mil and 20 mil pitch. Various surface metallizations have been explored and evaluated. Cure times and temperatures are being optimized. This paper will discuss design and fabrication of the test die, including surface metallization and the problems encountered therein. It will describe the process and its optimization.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
区域粘接倒装芯片贴片用区域粘接导电胶粘剂的评价
倒装芯片、DCA和CSP等新技术要求从周长键合焊盘转换为总面积键合模。为了满足这一需求,新的低成本区域粘合导电(ABC)粘合剂在ARPA TRP的资助下被开发出来。ABC胶粘剂是一种双区热固性胶粘剂,其导电性环氧胶粘剂被连续的氧化物填充的介电胶粘剂包围,形成一个总面积粘合。这两个区域都是无溶剂的,b级的,无粘性的环氧树脂,提供在迈拉载体释放膜上,固化,无挥发物或脱气,产生高Tg,高强度的粘合剂。与之前的随机粒子z轴胶粘剂相比,ABC胶粘剂仅在键垫位置具有导电区域。由奥本大学微电子中心设计和制造的区域键合测试模具已成功地键合到FR4、柔性和薄膜陶瓷基板上。测试模具的特点包括四点开尔文接触串和10毫米和20毫米间距的交叉雏菊链。各种表面金属化已被探索和评价。固化时间和温度正在优化。本文将讨论测试模具的设计和制造,包括表面金属化和在此过程中遇到的问题。它将描述过程及其优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Statistical optimization of high frequency LDMOS devices via hyper-fractionated experimental designs High temperature deformation of high density interconnects and packages by moire interferometry/FEM hybrid method Microsystems for medical applications The manufacturing logistics of cofire ceramic electronic packages Eutectic solder flip chip technology for chip scale package
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1