Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces

T. Asai, Masafumi Mori, T. Itou, Yasuhiro Take, M. Ikebe, T. Kuroda, M. Motomura
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Abstract

1,000 fps motion vector estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features ThruChip interfaces for high fps image transfer, orders of magnitude more area/power efficient motion vector estimation architecture compared to conventional ones, and a cognitive classification scheme employed on motion vector patterns, enabling the classification of moving objects not possible in conventional proposals.
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基于ThruChip接口的图像传感器/处理器3D堆叠系统的运动矢量估计和认知分类
提出了一种用于高速计算成像的3D堆叠成像仪/处理器模块的1,000 fps运动矢量估计和分类引擎,并进行了原型设计、组装和测试。该模块具有高fps图像传输的ThruChip接口,与传统的运动矢量估计架构相比,具有数量级的面积/功耗效率,以及采用运动矢量模式的认知分类方案,使传统提案无法对运动物体进行分类。
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Experimental demonstration of a nanoelectromechanical switch-based logic library including sequential and combinational gates A 1 Tb/s/mm2 inductive-coupling side-by-side chip link Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces A 433 MHz 54 µW OOK/FSK/PSK compatible wake-up receiver with 11 µW low-power mode based on injection-locked oscillator A 5-50 Gb/s quarter rate transmitter with a 4-tap multiple-MUX based FFE in 65 nm CMOS
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