First demonstration of threshold voltage control by sub-1V back-gate biasing for thin body and buried-oxide (TBB) Ge-on-insulator (GOI) MOSFETs for low-power operation

K. Ikeda, Y. Moriyama, M. Ono, Y. Kamimuta, T. Irisawa, Y. Kamata, A. Sakai, T. Tezuka
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引用次数: 7

Abstract

For the first time, fabrication of TBB-GOI MOSFETs and substantial Vth shifts within 1V back biasing have been demonstrated. The Vth control by extremely low back-gate biases was achieved by using the EOT-scaled BOX structure of ~12nm. This sub-1V back-gate biasing scheme can reduce the power consumption in LSIs without optional voltage supply or charge pump circuits which have large impact to reducing chip size and process cost.
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首次演示通过亚1v后门偏置控制薄体和埋氧化物(TBB)绝缘子上锗(GOI) mosfet的低功率工作阈值电压
首次证明了TBB-GOI mosfet的制造和1V背偏内的大量Vth移位。采用~12nm的eot尺度BOX结构实现了极低的后门偏置控制。这种低于1v的后门偏置方案可以降低lsi的功耗,而无需选择电压供应或电荷泵电路,这对减小芯片尺寸和工艺成本有很大的影响。
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