{"title":"A self-aligned vertical Kelvin test structure to measure contact resistivities of Al and Ti on Si","authors":"W. Yang, T. F. Lei, C. Lee","doi":"10.1109/VMIC.1989.78030","DOIUrl":null,"url":null,"abstract":"A self-aligned vertical Kelvin test resistor structure, which not only eliminates the horizontal current crowding but also avoids the misalignment error, is proposed and used to measure p/sub c/ of Al and Ti on Si. For the Al(1%Si)/n/sup +/-Si contact system, a specific contact resistivity of 1*10/sup -7/ Omega -cm/sup 2/ has been measured. For the TiSi/sub 2/ contacts, the TiSi/sub 2/(direct-reaction)/n/sup +/-Si contact offers a lower p/sub c/ than that of the coevaporated TiSi/sub 2//n/sup +/-Si contact, and p/sub c/ does not change even after the contacts are annealed to 900 degrees C.<<ETX>>","PeriodicalId":302853,"journal":{"name":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VMIC.1989.78030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A self-aligned vertical Kelvin test resistor structure, which not only eliminates the horizontal current crowding but also avoids the misalignment error, is proposed and used to measure p/sub c/ of Al and Ti on Si. For the Al(1%Si)/n/sup +/-Si contact system, a specific contact resistivity of 1*10/sup -7/ Omega -cm/sup 2/ has been measured. For the TiSi/sub 2/ contacts, the TiSi/sub 2/(direct-reaction)/n/sup +/-Si contact offers a lower p/sub c/ than that of the coevaporated TiSi/sub 2//n/sup +/-Si contact, and p/sub c/ does not change even after the contacts are annealed to 900 degrees C.<>