Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, K. Okamoto
{"title":"New precision wafer bonding technologies for 3DIC","authors":"Isao Sugaya, Hajime Mitsuishi, Hidehiro Maeda, K. Okamoto","doi":"10.1109/3DIC.2015.7334575","DOIUrl":null,"url":null,"abstract":"A new precision wafer-to-wafer (W2W) bonding system for three-dimensional integrated circuits (3DICs) fabrication including a new precision alignment methodology and a unique thermocompression bonding procedure is proposed. Experimental results show that the alignment capability is 100 nm or better, and permanent bonding accuracy of 260 nm (|mean| + 3σ) in 300 mm Cu wafer bonding. An analysis of overlay error components is useful for identifying the causes of the error and improving the tool conditions. These capabilities are key enablers for the future of cost-effective 3DIC manufacturing.","PeriodicalId":253726,"journal":{"name":"2015 International 3D Systems Integration Conference (3DIC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC.2015.7334575","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
A new precision wafer-to-wafer (W2W) bonding system for three-dimensional integrated circuits (3DICs) fabrication including a new precision alignment methodology and a unique thermocompression bonding procedure is proposed. Experimental results show that the alignment capability is 100 nm or better, and permanent bonding accuracy of 260 nm (|mean| + 3σ) in 300 mm Cu wafer bonding. An analysis of overlay error components is useful for identifying the causes of the error and improving the tool conditions. These capabilities are key enablers for the future of cost-effective 3DIC manufacturing.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
