I. Yahya, N. A. A. Ghani, M. M. Salleh, H. A. Hamid, Z. Ahmad, R. Mayappan
{"title":"Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)","authors":"I. Yahya, N. A. A. Ghani, M. M. Salleh, H. A. Hamid, Z. Ahmad, R. Mayappan","doi":"10.1109/IEMT.2012.6521765","DOIUrl":null,"url":null,"abstract":"Due to environmental concern regarding toxicity of lead-based solder, the lead-free solders were introduced as a replacing solder in microelectronics devices technology. In this study, the effects of 0.1, 0.4 and 0.7 wt% Zn additions on the intermetallic formation and thickness of Sn-3.5Ag-1.0Cu solder on Cu substrate after long time aging were investigated. The X-Ray Diffraction (XRD) analysis shown that there were Cu6Sn5, Cu3Sn, β-Sn, CuZn and Ag3Sn phase formed after sintering process. The morphology of the intermetallic was observed under Scanning Electron Microscope (SEM) and the elemental distribution was confirmed by Energy Dispersive X-ray (EDX). The intermetallic thickness increases as the aging temperature increases while the addition of zinc into the system has suppressed the intermetallic formation.","PeriodicalId":315408,"journal":{"name":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2012.6521765","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Due to environmental concern regarding toxicity of lead-based solder, the lead-free solders were introduced as a replacing solder in microelectronics devices technology. In this study, the effects of 0.1, 0.4 and 0.7 wt% Zn additions on the intermetallic formation and thickness of Sn-3.5Ag-1.0Cu solder on Cu substrate after long time aging were investigated. The X-Ray Diffraction (XRD) analysis shown that there were Cu6Sn5, Cu3Sn, β-Sn, CuZn and Ag3Sn phase formed after sintering process. The morphology of the intermetallic was observed under Scanning Electron Microscope (SEM) and the elemental distribution was confirmed by Energy Dispersive X-ray (EDX). The intermetallic thickness increases as the aging temperature increases while the addition of zinc into the system has suppressed the intermetallic formation.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
