{"title":"Investigation on Physical Origins of Output Capacitance Loss in Cascode GaN HEMTs","authors":"Q. Song, Ruizhe Zhang, Qiang Li, Yuhao Zhang","doi":"10.1109/APEC43580.2023.10131161","DOIUrl":null,"url":null,"abstract":"Output capacitance loss is generated when the output capacitor of a power device is charged and discharged in its OFF state, which ideally should be a lossless process. This loss information is not included in the device datasheet but is crucial for device applications. Some recent work has revealed significant EDISS in GaN high-electron-mobility transistors (HEMTs), which compromise their performance in high-frequency soft-switching converters. Among various GaN devices, the cascode GaN HEMT was reported to show the largest EDISS, but its physical origin is unknown. This work investigates several possible physical origins such as the EDISS of GaN HEMT and the Si avalanche loss. The EDISS of two cascode GaN HEMTs, one with and the other without an additional capacitor in parallel with the Si MOSFET, are characterized. Three components of EDISS in cascode GaN HEMTs are quantitatively separated: a) Si avalanche loss, b) GaN HEMT's inherent EDISS, and c) additional loss due to the interaction between Si MOSFET and GaN HEMT when the Si MOSFET avalanches. At high voltage, component c) is revealed to dominate. By eliminating the Si avalanche, the EDISS of cascode GaN HEMTs can be reduced by up to 75%. These results provide new physical insights and manifest an effective way to reduce EDISS in casco de GaN HEMTs, which significantly boost its performance in soft- switching applications.","PeriodicalId":151216,"journal":{"name":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43580.2023.10131161","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Output capacitance loss is generated when the output capacitor of a power device is charged and discharged in its OFF state, which ideally should be a lossless process. This loss information is not included in the device datasheet but is crucial for device applications. Some recent work has revealed significant EDISS in GaN high-electron-mobility transistors (HEMTs), which compromise their performance in high-frequency soft-switching converters. Among various GaN devices, the cascode GaN HEMT was reported to show the largest EDISS, but its physical origin is unknown. This work investigates several possible physical origins such as the EDISS of GaN HEMT and the Si avalanche loss. The EDISS of two cascode GaN HEMTs, one with and the other without an additional capacitor in parallel with the Si MOSFET, are characterized. Three components of EDISS in cascode GaN HEMTs are quantitatively separated: a) Si avalanche loss, b) GaN HEMT's inherent EDISS, and c) additional loss due to the interaction between Si MOSFET and GaN HEMT when the Si MOSFET avalanches. At high voltage, component c) is revealed to dominate. By eliminating the Si avalanche, the EDISS of cascode GaN HEMTs can be reduced by up to 75%. These results provide new physical insights and manifest an effective way to reduce EDISS in casco de GaN HEMTs, which significantly boost its performance in soft- switching applications.
功率器件的输出电容在OFF状态下充放电时产生输出电容损耗,理想情况下应该是一个无损的过程。该损失信息不包括在设备数据表中,但对设备应用程序至关重要。最近的一些工作揭示了氮化镓高电子迁移率晶体管(hemt)中显著的edis,这损害了它们在高频软开关变换器中的性能。在各种GaN器件中,级联GaN HEMT被报道显示出最大的EDISS,但其物理来源尚不清楚。这项工作研究了几种可能的物理起源,如GaN HEMT的EDISS和Si雪崩损失。本文描述了两个级联GaN hemt(一个有和另一个没有与Si MOSFET并联的附加电容)的EDISS。级联GaN HEMT中EDISS的三个组成部分被定量分离:a) Si雪崩损耗,b) GaN HEMT固有的EDISS,以及c) Si MOSFET雪崩时Si MOSFET与GaN HEMT相互作用的额外损耗。在高电压下,组分c)占主导地位。通过消除Si雪崩,级联GaN hemt的EDISS可以降低高达75%。这些结果提供了新的物理见解,并表明了一种有效的方法来减少casco de GaN hemt中的EDISS,从而显着提高其在软开关应用中的性能。