Quantifying moisture diffusion into three-dimensional axisymmetric sealants

D. Leslie, A. Dasgupta, J. D. de Vries
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引用次数: 4

Abstract

Moisture can be devastating for electronic components, causing corrosion and electrochemical metal migration, which leads to changes in resistance and short circuits. Although most products (the focus in this study is on solid state lighting products) have a sealed enclosure, the driver electronics are often not as well sealed against the environment. Moisture diffusion through surrounding sealants is a primary pathway of moisture ingress into the electronics enclosures. This study's focus is on quantifying the moisture diffusion rates for various sealant materials and on modeling the moisture ingress rates into sealed containers, using commercial FEA software. This paper also presents a simulation-assisted procedure to extract the moisture diffusion properties for the seal material because most seal structures (gaskets, O-rings, etc.) are not simple one-dimensional structures. The resulting geometric correction factor is obtained for toroidal O-rings of circular cross-section and also for elliptic cross-sections caused by compression forces.
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定量水分在三维轴对称密封胶中的扩散
湿气对电子元件是毁灭性的,会造成腐蚀和电化学金属迁移,从而导致电阻的变化和短路。虽然大多数产品(本研究的重点是固态照明产品)都有一个密封的外壳,但驱动电子设备通常不会对环境进行密封。水分通过周围密封剂扩散是水分进入电子外壳的主要途径。本研究的重点是量化各种密封材料的水分扩散率,并利用商业有限元软件对密封容器的水分进入率进行建模。由于大多数密封结构(垫片、o形环等)不是简单的一维结构,本文还提出了一种模拟辅助程序来提取密封材料的水分扩散特性。得到了圆形截面的环形o形环和受压缩力影响的椭圆截面的几何校正系数。
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