High power UV-LED-clusters on ceramic substrates

M. Schneider, Christian Herbold, K. Messerschmidt, K. Trampert, J. Brandner
{"title":"High power UV-LED-clusters on ceramic substrates","authors":"M. Schneider, Christian Herbold, K. Messerschmidt, K. Trampert, J. Brandner","doi":"10.1109/ECTC.2010.5490793","DOIUrl":null,"url":null,"abstract":"We present a high power density UV-LED module for a wavelength of 395 nm with an optical power density of 13.1 W/cm2. The module consists of 98 densely packed LED chips adhesively bonded to an Al2O3-ceramic board. Thermal simulations and measurements as well as optical measurements were conducted. The module was cooled by a forced air heat sink for the characterization experiments. A surface micro cooler with water as a coolant is proposed to improve thermal performance of the module. To drive the LED module, we developed an efficient current source powered directly from AC mains supply with integrated power factor correction using a single switching component.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"218 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2010.5490793","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

We present a high power density UV-LED module for a wavelength of 395 nm with an optical power density of 13.1 W/cm2. The module consists of 98 densely packed LED chips adhesively bonded to an Al2O3-ceramic board. Thermal simulations and measurements as well as optical measurements were conducted. The module was cooled by a forced air heat sink for the characterization experiments. A surface micro cooler with water as a coolant is proposed to improve thermal performance of the module. To drive the LED module, we developed an efficient current source powered directly from AC mains supply with integrated power factor correction using a single switching component.
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陶瓷基板上的大功率uv - led簇
我们提出了一种波长为395 nm的高功率密度UV-LED模块,光功率密度为13.1 W/cm2。该模块由98个密集封装的LED芯片组成,这些芯片粘接在al2o3陶瓷板上。进行了热模拟和测量以及光学测量。该模块由强制空气散热器冷却,用于表征实验。提出了一种以水为冷却剂的表面微冷却器,以提高模块的热性能。为了驱动LED模块,我们开发了一种高效的电流源,直接由交流电源供电,使用单个开关元件集成功率因数校正。
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