E. Ramanathan, Lei Jiang, Q. Takmeel, Silvestre MaryClaire, AnbuSelvam KM Mahalingam, Somnath Ghosh, K. Donegan, A. Chandrasekar, Sunil K. Singh, Henrik Johanson, D. Damjanovic, Zhiguo Sun, A. Sircar, S. Eah, Colin Bombardier, A. daSilva, Brendan O'Brien, A. Roux, B. Cucci, Ordonio Christopher, C. Montgomery, Vandana Venkatasubramanian, Vijaya Rana, J. Mody, J. Shepard, C. Child, B. Morganfeld, Rebekah Sheraw
{"title":"Impact of Sacrificial Hard Mask Material in BEOL Integration in Advanced Technology","authors":"E. Ramanathan, Lei Jiang, Q. Takmeel, Silvestre MaryClaire, AnbuSelvam KM Mahalingam, Somnath Ghosh, K. Donegan, A. Chandrasekar, Sunil K. Singh, Henrik Johanson, D. Damjanovic, Zhiguo Sun, A. Sircar, S. Eah, Colin Bombardier, A. daSilva, Brendan O'Brien, A. Roux, B. Cucci, Ordonio Christopher, C. Montgomery, Vandana Venkatasubramanian, Vijaya Rana, J. Mody, J. Shepard, C. Child, B. Morganfeld, Rebekah Sheraw","doi":"10.1109/ASMC.2019.8791788","DOIUrl":null,"url":null,"abstract":"As technology scaling continues, the selection of materials for sacrificial hard masks become very critical. Sacrificial hard masks are thin films that are used for patterning or protecting critical underlying films from damage during various processes like etching, deposition or planarization. In this article, we discuss the effect of the sacrificial hard mask material on the erosion in the self-aligned via (SAV) patterning process, selectivity in the etch process, adhesion, defectivity, and metallization.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791788","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
As technology scaling continues, the selection of materials for sacrificial hard masks become very critical. Sacrificial hard masks are thin films that are used for patterning or protecting critical underlying films from damage during various processes like etching, deposition or planarization. In this article, we discuss the effect of the sacrificial hard mask material on the erosion in the self-aligned via (SAV) patterning process, selectivity in the etch process, adhesion, defectivity, and metallization.
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