A 'virtual waferscale' multichip module system

Abstract

A new concept in multichip modules is presented that represents a potential 'next step' in packaging for solid state electronic systems. A unique heat sink material, in the form of a compacted particulate paste provides a firm three dimensional support to die without adhesion to the die. The material also provides a direct thermal shunt between a die and its casing. The resulting low thermal resistance /spl Theta//sub jc/ allows an array of die to be placed into a single module where the die spacing can be such that direct die to die interconnects are possible. A dense array of die with direct die to die interconnects will behave electronically as if it were a single die. A 'virtual waferscale' 128 Mb SRAM memory block, fabricated as a 32 die array, is considered.