A new hierarchical RSM for TCAD-based device design to predict CMOS development

H. Sato, K. Tsuneno, K. Aoyama, T. Nakamura, H. Kunitomo, H. Masuda
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引用次数: 5

Abstract

A new methodology in simulation-based CMOS process designs has been proposed, using a hierarchical RSM (Response Surface Method) and efficient experimental calibrations. The new design methodology has been verified in a half-micron CMOS process/device development using the test structure, which results in reliable prediction of the threshold voltage (Vth) and drain current (Ids) within 0.01 V and 0.84% errors, respectively. This method has also reduced simulation works to about one half required by the conventional RSM. TCAD based RSM is applied for predicting quarter-micron CMOS development.
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一种新的基于tcad的器件设计分层RSM,用于预测CMOS的发展
提出了一种基于仿真的CMOS工艺设计的新方法,该方法采用分层响应面法(RSM)和高效的实验校准。新的设计方法已经在半微米CMOS工艺/器件开发中得到验证,使用该测试结构可以可靠地预测阈值电压(Vth)和漏极电流(Ids),误差分别在0.01 V和0.84%以内。该方法还将仿真工作量减少到传统RSM的一半左右。将基于TCAD的RSM应用于预测四分之一微米CMOS的发展。
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