L. Wai, Kazunori Yamamoto, G. Tang, Jacob Jordon Soh
{"title":"Pressure-assist Silver Sintering Paste for SiC Power Device Attachment on Lead Frame Based Package","authors":"L. Wai, Kazunori Yamamoto, G. Tang, Jacob Jordon Soh","doi":"10.1109/ectc51906.2022.00349","DOIUrl":null,"url":null,"abstract":"The process development of a novel pressure-assist pates for high performance silicon carbide metal-oxide semiconductor field-effect transistor (SiC MOSFET) was carried out. In this study, high shear strength on silver sintered die attach layer can be achieved. Interconnect process developed for gate pad (pad size = 0.8mm x 0.5mm) and source pad (pad size= 1.04mmx3.97mm) with copper clips and tin antimony (SnSb) solder passed the criteria of power cycling test. Highly densify silver sintered layer can be achieved by pressure-laser sintering process for pressure-assist type silver sintering paste.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00349","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The process development of a novel pressure-assist pates for high performance silicon carbide metal-oxide semiconductor field-effect transistor (SiC MOSFET) was carried out. In this study, high shear strength on silver sintered die attach layer can be achieved. Interconnect process developed for gate pad (pad size = 0.8mm x 0.5mm) and source pad (pad size= 1.04mmx3.97mm) with copper clips and tin antimony (SnSb) solder passed the criteria of power cycling test. Highly densify silver sintered layer can be achieved by pressure-laser sintering process for pressure-assist type silver sintering paste.
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