A. Tomada, S. Boutet, B. Duda, P. Hart, C. Kenney, L. Manger, M. Messerschmidt, J. Tice, G. Williams
{"title":"High-Z radiation shields for x-ray free electron laser detectors","authors":"A. Tomada, S. Boutet, B. Duda, P. Hart, C. Kenney, L. Manger, M. Messerschmidt, J. Tice, G. Williams","doi":"10.1109/NSSMIC.2012.6551159","DOIUrl":null,"url":null,"abstract":"The Linac Coherent Light Source (LCLS) produces brilliant x-ray in femtosecond pulses of high intensity. Many of the experiments performed at the LCLS use expensive pixel area detectors - the majority of which incorporate custom integrated circuit chips (ASIC). Such circuit chips are susceptible to radiation damage. To protect against this, micro-patterned tungsten foils were designed to cover the section of the circuit chip that extends beyond the sensor near the wire-bond pads. A description of the problem along with the details of how the tungsten foils were fabricated and installed will be given.","PeriodicalId":187728,"journal":{"name":"2012 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Nuclear Science Symposium and Medical Imaging Conference Record (NSS/MIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NSSMIC.2012.6551159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The Linac Coherent Light Source (LCLS) produces brilliant x-ray in femtosecond pulses of high intensity. Many of the experiments performed at the LCLS use expensive pixel area detectors - the majority of which incorporate custom integrated circuit chips (ASIC). Such circuit chips are susceptible to radiation damage. To protect against this, micro-patterned tungsten foils were designed to cover the section of the circuit chip that extends beyond the sensor near the wire-bond pads. A description of the problem along with the details of how the tungsten foils were fabricated and installed will be given.