MEMS in QFN

Abstract

In recent years, MEMs IC (Micro-Electro-Mechanical Systems) has gained its growth momentum in the growing smart phone and other consumer electronic market. In addition to consumer electronic market, MEMs IC also has its application in industrial, medical, environmental and other specific application. With the high volume, lower cost demand for MEMs IC for consumer electronics, MEMs packaging trend has evolved towards using the existing matured lower cost packaging method including QFN (Quad Flat No-lead Package). In general, MEMS packaging is more challenging than normal IC packaging due to these devices generally required more stringent evaluation of suitable packaging material properties and manufacturing methodology.This paper introduces the package and process development of a Gyroscope MEMS on QFN packaging solution. The discussions include issues and challenges encountered during the package and process development, associated solutions in packaging material selection, and manufacturing techniques.