Temperature effect on tribological and mechanical properties of MEMS

M. Pustan, C. Bîrleanu, C. Dudescu, O. Belcin
{"title":"Temperature effect on tribological and mechanical properties of MEMS","authors":"M. Pustan, C. Bîrleanu, C. Dudescu, O. Belcin","doi":"10.1109/EUROSIME.2013.6529890","DOIUrl":null,"url":null,"abstract":"The scope of this paper is to analyze the temperature effect on tribological and mechanical properties of materials used in the fabrication of the flexible components from Microelectromechanical Systems (MEMS). Using a temperature control system and an atomic force microscope (AFM) with a nanoindentation module, the changes of the mechanical and tribological properties of MEMS material as a function of temperature are investigated. The temperature has influence on the tribological and mechanical behaviors of materials based on thermal relaxation. Firstly, the temperature effect on hardness and contact stiffness of MEMS materials is investigated. The coupling of the strain field to a temperature field provides an energy dissipation mechanism that allows the material to relax. In the case of investigated MEMS materials, the relaxation strength to be considered is that of the modulus of elasticity with influence on contact stiffness and hardness. Secondly, the temperature influence on tribological properties is determined. The tribological investigation of interest is the friction force measurement as a function of temperature. The direct measurement of the temperature effect on tribological and mechanical behavior of MEMS materials is important in order to improve the reliability design of MEMS and to increase the lifetime of microstructures from MEMS applications.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529890","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The scope of this paper is to analyze the temperature effect on tribological and mechanical properties of materials used in the fabrication of the flexible components from Microelectromechanical Systems (MEMS). Using a temperature control system and an atomic force microscope (AFM) with a nanoindentation module, the changes of the mechanical and tribological properties of MEMS material as a function of temperature are investigated. The temperature has influence on the tribological and mechanical behaviors of materials based on thermal relaxation. Firstly, the temperature effect on hardness and contact stiffness of MEMS materials is investigated. The coupling of the strain field to a temperature field provides an energy dissipation mechanism that allows the material to relax. In the case of investigated MEMS materials, the relaxation strength to be considered is that of the modulus of elasticity with influence on contact stiffness and hardness. Secondly, the temperature influence on tribological properties is determined. The tribological investigation of interest is the friction force measurement as a function of temperature. The direct measurement of the temperature effect on tribological and mechanical behavior of MEMS materials is important in order to improve the reliability design of MEMS and to increase the lifetime of microstructures from MEMS applications.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
温度对MEMS摩擦学和力学性能的影响
本文的研究范围是分析温度对用于制造微机电系统(MEMS)柔性元件的材料摩擦学和力学性能的影响。利用温度控制系统和带有纳米压痕模块的原子力显微镜(AFM),研究了MEMS材料的力学性能和摩擦学性能随温度的变化。温度对材料的摩擦学和力学行为具有基于热松弛的影响。首先,研究了温度对MEMS材料硬度和接触刚度的影响。应变场与温度场的耦合提供了一种能量耗散机制,使材料松弛。对于所研究的MEMS材料,要考虑的松弛强度是弹性模量对接触刚度和硬度的影响。其次,确定了温度对摩擦学性能的影响。摩擦学研究感兴趣的是作为温度函数的摩擦力的测量。直接测量温度对MEMS材料摩擦学和力学行为的影响对于提高MEMS的可靠性设计和增加MEMS应用中微结构的使用寿命具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Modeling of mixed-mode delamination by cohesive zone method Resistance electric filed dependence simulation of piezoresistive silicon pressure sensor and improvement by shield layer Reliability investigation of system in package devices toward aeronautic requirements: Methodology and application Adhesion of printed circuit boards with bending and the effect of reflow cycles Bonding wire life prediction model of the power module under power cycling test
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1