A novel broadband flip chip interconnection

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634070

J. Kim, D. Koh, T. Itoh

引用次数: 5

Abstract

Flip chip interconnections with CPW structures are studied. A novel broadband flip chip interconnection design is proposed based on the results of the sensitivity analysis performed by the Finite Difference Time Domain (FDTD) method.

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一种新型宽带倒装芯片互连

研究了用CPW结构的倒装芯片互连。基于时域有限差分法(FDTD)的灵敏度分析结果，提出了一种新的宽带倒装芯片互连设计方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical Performance of Electronic Packaging

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