S. Oh, K. Okasaki, J. Moll, O. S. Nakagawa, N. Chang
{"title":"3D Global Interconnect Parameter ExtractoR for full-chip global critical path analysis","authors":"S. Oh, K. Okasaki, J. Moll, O. S. Nakagawa, N. Chang","doi":"10.1109/EPEP.1997.634036","DOIUrl":null,"url":null,"abstract":"A 3D Global Interconnect Parameter ExtractoR (GIPER) has been developed to provide a practical extraction tool for the full-chip global critical path analysis. It extracts the interconnect parameters (R,C) of a typical global interconnect within several minutes per net on a HP 9000/755 workstation within 5% accuracy compared to full 3D numerical simulations.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"89 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634036","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A 3D Global Interconnect Parameter ExtractoR (GIPER) has been developed to provide a practical extraction tool for the full-chip global critical path analysis. It extracts the interconnect parameters (R,C) of a typical global interconnect within several minutes per net on a HP 9000/755 workstation within 5% accuracy compared to full 3D numerical simulations.