100 W High Power Amplifier MMIC in 0.45 μm GaN Technology

Pramod K. Singh, K. Suman, Santosh K Gedela, Kishore Bantupalli, K. Y. Varma, R. Gongo
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引用次数: 1

Abstract

Very high output power level is achieved at microwave frequencies using Gallium Nitride technologies due to high breakdown voltage, high current density and high carrier mobility in AlGaN/GaN based High Electron Mobility Transistors. The specific 0.45 $\mu$m AlGaN/GaN on SiC HEMT based MMIC technology is developed for this purpose to operate at high DC bias voltage of 50 V to achieve high power at microwave frequencies. This paper demonstrates that a high microwave power exceeding 100 W can be achieved from a single MMIC chip fully matched to 50 Ohm at S-band frequencies. In addition to high power, high power added efficiency greater than 50% is also achieved in this chip. The implemented high-power amplifier chip is a two-stage amplifier achieving output power greater than 50 dBm with power gain better than 22 dB, and power added efficiency exceeding 50% over frequency range of 3.1-3.5 GHz. The MMIC chip layout area is as compact as 5.8 $\times$ 3.3 mm2. The saturated output power density of transistor in this chip reaches value of 7 W/mm, maximum possible in this technology.
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采用0.45 μm GaN技术的100w高功率放大器MMIC
在基于AlGaN/GaN的高电子迁移率晶体管中,由于高击穿电压、高电流密度和高载流子迁移率,使用氮化镓技术在微波频率下实现了非常高的输出功率水平。为此,开发了基于SiC HEMT的特定0.45 $\mu$m AlGaN/GaN的MMIC技术,该技术可在50 V的高直流偏置电压下工作,从而在微波频率下实现高功率。本文证明了在s波段完全匹配50欧姆的单个MMIC芯片可以实现超过100 W的高微波功率。除了高功率,该芯片还实现了大于50%的高功率附加效率。所实现的大功率放大芯片是一种两级放大器,在3.1-3.5 GHz频率范围内,输出功率大于50 dBm,功率增益优于22 dB,功率附加效率超过50%。MMIC芯片布局面积为5.8 × 3.3 mm2。该芯片晶体管的饱和输出功率密度达到7w /mm,是目前该技术所能达到的最大值。
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