{"title":"A study to improve IGBT reliability in power electronics applications","authors":"V. Sundaramoorthy, E. Bianda, G. Riedel","doi":"10.1109/SMICND.2015.7355149","DOIUrl":null,"url":null,"abstract":"Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.","PeriodicalId":325576,"journal":{"name":"2015 International Semiconductor Conference (CAS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International Semiconductor Conference (CAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2015.7355149","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Lifetime prediction of IGBT modules from their junction temperature is an important aspect to improve the reliability of power electronic systems. Here, methods to estimate the IGBT junction temperature from its electrical characteristics are discussed. A solution is also proposed to avoid explosion of IGBTs used in traction converters.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
