Operation of functional circuit elements using BEOL-transistor with InGaZnO channel for on-chip high/low voltage bridging I/Os and high-current switches

K. Kaneko, H. Sunamura, M. Narihiro, S. Saito, N. Furutake, M. Hane, Y. Hayashi
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引用次数: 13

Abstract

Functional circuit elements based on novel BEOL-transistors with a wide-band-gap oxide semiconductor InGaZnO (IGZO) film are integrated onto LSI Cu-interconnects, and their operations are demonstrated. High-current comb-type transistors show excellent Ion/Ioff ratio (>;108) and high-Vd operation with linear area dependence, realizing area-saving compact high-current BEOL switches. Successful operation of voltage-controlled inverter switches with high-Vd enables on-chip bridging I/Os between high/low voltage on conventional Si system LSIs. Setting the gate-to-drain offset design to just 0.1μm realizes +20V enhancement of the breakdown voltage to ~60V with excellent safety operation at around Vd=50V due to the wide-band-gap characteristics.
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使用带InGaZnO通道的beol晶体管进行片上高/低压桥接I/ o和大电流开关的功能电路元件的操作
基于新型beol晶体管和宽带隙氧化物半导体InGaZnO (IGZO)薄膜的功能电路元件集成到LSI cu互连上,并演示了它们的工作原理。大电流梳状晶体管具有优异的离子/断流比(>;108)和线性面积依赖的高vd操作,实现了节省面积的紧凑大电流BEOL开关。具有高vd的压控逆变开关的成功操作使传统Si系统lsi上的高/低电压之间的片上桥接I/ o成为可能。将栅极-漏极偏置设计设置为0.1μm,击穿电压提高+20V至~60V,并且由于宽带隙特性,在Vd=50V附近具有出色的安全工作性能。
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